How Does PCB Via Filling Improve Thermal Conductivity?
PCB Via Filling Improve Thermal Conductivity
When it comes to pcb via filling, there are many options available for the designer to choose from. Some of these include conductive and non-conductive fill materials. Choosing the right one for your project will help ensure that signals are transferred accurately and that the integrity of your board is maintained. The decision also needs to take into account the costs involved in the production process.
The most popular choice for via filling is copper, as it has a high level of thermal conductivity and is relatively affordable. However, copper is not without its disadvantages. For example, it can create an outer layer that is too thick for the design, resulting in stress fractures and poor connections. Additionally, it can add too much copper to the traces, making the circuit board heavier than necessary and increasing the cost.
In order to avoid these issues, it is important to carefully evaluate the design and select the appropriate via size and shape. The best way to do this is to use a tool like X-ray imaging or an electrical resistance tester. The resulting information can then be used to create the correct via size and shape, ensuring that signals are transferred accurately and that your board will remain structurally sound.
There are various ways to fill a via hole, with the most common being the use of a solder paste. These pastes typically contain metal particles suspended in a binder and are applied using stencil printing or syringe dispensing methods. They are then cured to solidify the conductive fill. This method is usually employed when manufacturing a class 2 or higher PCB, as it is required that a minimum of 5% of the via barrel be filled with solder.
How Does PCB Via Filling Improve Thermal Conductivity?
For the remainder of the vias on a PCB, the most commonly used option is a non-conductive fill material. These are typically epoxy based and include both non-conductive and silver conductive epoxy resins. Depending on the specific application, these may be ideal for your project. However, it is essential to note that the CTE values of these epoxies need to match those of the surrounding laminate material in order to prevent stress fractures as the structure expands or contracts over time.
Conductive via fills are a good choice for legacy products and other projects that require a high level of current or heat. This is because the copper’s high thermal conductivity helps to keep the heat away from critical areas of the circuit, preventing overheating and premature failure.
The selection of the right via fill for your project will depend on several factors, including the manufacturing process and your budget. It is always a good idea to consult with the experts at WellPCB for more advice on which type of via fill is best for your particular design. They have a team of experienced professionals ready to answer all your questions and will ensure that your board is manufactured to the highest quality standards within the shortest possible timeframe.